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Potting (electronics): Difference between revisions

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== External links == == External links ==

Revision as of 00:12, 30 October 2009

A small transformer potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box.

In electronics, potting is a process of filling a complete electronic assembly with a solid compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents. Thermosetting plastics are often used.

Most circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair.

When potting a circuit board that uses surface-mount technology, it is recommended to use low Tg potting compounds such as polyurethane or silicone, because high Tg potting compounds may break solder bonds as they harden and shrink at low temperatures.

External links

  1. Template:Dmoz
  2. Potting Solutions: "Potting PC boards"
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